Produk
Interflux
IF 2005M Soldering Flux
Interflux® IF 2005M is a low solids noclean flux, designed to evaporate during the soldering process. This means also the safest no-clean flux for hightech circuits.
With no rosin nor resin present to create a sticky residue, there is nothing left after wave soldering to foul test pins or prevent electrical contact. Furthermore, machine and carrier pollution are very little compared to other fluxes.
This absolutely halide free flux meets all Bellcore and IPC requirements and is QPL- listed (approved to MIL-F14256F). It is formulated to provide the best combination of solderability,
ease of processing and reliability. Great solderability on HAL, Ni Au, I-Sn, I-Ag and OSP coated PCB’s.
With no rosin nor resin present to create a sticky residue, there is nothing left after wave soldering to foul test pins or prevent electrical contact. Furthermore, machine and carrier pollution are very little compared to other fluxes.
This absolutely halide free flux meets all Bellcore and IPC requirements and is QPL- listed (approved to MIL-F14256F). It is formulated to provide the best combination of solderability,
ease of processing and reliability. Great solderability on HAL, Ni Au, I-Sn, I-Ag and OSP coated PCB’s.
