A paste external release agent which dries at room temperature forms a monomolecular film which adheres by absorption to the mold surface and has no affinity for the molded resin or rubber.

This selective Epoxy Resin and Adhesive product prevents the film from being easily peeled off by the molded parts. Much de-molding per application of the release material can be expected without the need to wash the parts. This removal will not interfere with secondary finishing operations such as decorating, bonding or painting. Can be polished to a shine.

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